Strong semi growth - except for DRAM, says ESIA
European semiconductor sales in December amounted to $ 2.8bn - 5.5% down on November, reports the European SIA citing WSTS figures.
Fri, 03 Feb 2012 15:34:00 GMT

Job of the Week: Cisco Hardware Leader
Cisco is recruiting a Hardware Leader - the job functions are Principal Engineer, Project Leader, and Team Leader. Based in Slough, it is a permanent full-time role and the salary and benefits are negotiable.
Fri, 03 Feb 2012 15:33:00 GMT

China Mobile director Madam Li Mofang honoured by IET
Madam Li Mofang receives the honour in recognition of her outstanding work in engineering, particularly in China and the world of mobile telecommunications
Fri, 03 Feb 2012 11:39:00 GMT

Defence Minister opens TRaC?s test facility in Dorset
The test house plans to consolidate and expand its EMC and environmental test services at this single location
Fri, 03 Feb 2012 11:24:00 GMT

Cellergy cuts its supercapacitor leakage
Super capacitor manufacturer Cellergy has launched a lower-leakage range. "The 12mm square CLC range offers 50% lower leakage than the current CLG...
Fri, 03 Feb 2012 11:20:00 GMT

Renesas says debug support is key for Eclipse C/C++ tools
The supplier is tapping in to the design momentum which has built up behind the Eclipse C/C++ development toolkit (CDT). But Renesas believes there has been the lack of generic debug support
Fri, 03 Feb 2012 10:32:00 GMT

Thinnest 1.5A diode yet
NXP is claiming a first, with a Schottky diode only 0.37mm thick. "It is the smallest plastic package on the market and...
Fri, 03 Feb 2012 10:15:00 GMT

Comment: India's panel price crash could spark solar revolution
Solar power has always had a reputation for being expensive, but not for much longer. In India, electricity from solar is now cheaper than that from diesel generators. The news - which will boost India's "Solar Mission" to install 20,000 megawatts of solar power by 2022 - could have implications for other developing nations too.
Fri, 03 Feb 2012 09:36:00 GMT

Wolfson intros low noise MP3 audio chip for smartphones
The WM1811 has a 2W stereo Class D speaker driver and Class W headphone driver
Fri, 03 Feb 2012 00:05:00 GMT

Manchester University improves graphene off state
Astonishing conductivity helped the discoverers of graphene win the Nobel prize in physics in 2010. Now a way to switch off the easy flow of electrons in this form of carbon is bringing superfast graphene computers closer.
Fri, 03 Feb 2012 00:02:00 GMT

eoSemi gets $2.3m investment for quartz replacements
?An endorsement of the progress made by our team towards bringing that technology to market,? said eoSemi CEO Ian Macbeth
Fri, 03 Feb 2012 00:01:00 GMT

Eurotech wins ?4m embedded computer deal in Japan
Deliveries will begin in second half of 2012 and will be completed in about 3 years
Fri, 03 Feb 2012 00:01:00 GMT

Qinetiq supplies electric drive for US tank tests
BAE Systems and Northrop Grumman, recently awarded $450m to develop the US Army's Ground Combat Vehicle (GCV), have gone to QinetiQ for a hybrid-electric track drive. Called E-X-Drive, "the transmission...
Thu, 02 Feb 2012 16:01:00 GMT

FTDI adds touch capability to its open source platform
The Vinco Touch Key applications board, which the supplier calls a shield mates with the Vinco motherboard, and incorporates a STMicroelectronics STMPE821 8-channel general purpose input/output (GPIO) capacitive touch key controller IC
Thu, 02 Feb 2012 13:03:00 GMT

LeCroy adds automotive test kits for MOST and BroadR-Reach
"These standards have emerged in response to the rapidly increasing customer demand for devices connected to video displays and car infotainment systems," said the firm
Thu, 02 Feb 2012 12:45:00 GMT

Intel's wireless chips denied latest processes.
Intel?s move on the wireless market may fail for the same reason that its X-Scale and ASIC ventures failed ? because it?s not putting its wireless parts on advanced processes.
Thu, 02 Feb 2012 11:59:00 GMT

Comment: Intel, ARM - Are we on the brink of another tablet patent war?
It seems that hardly another day goes by without another global consumer electronics giant filing a patent lawsuit against another, writes Alan MacDougall, a Chartered Patent Attorney and partner at IP advisers Mathys & Squire LLP.
Thu, 02 Feb 2012 11:10:00 GMT

Acal reports gross profit rise of 4%
?The Group is making continued progress with growth in gross profits and margins, and remains on track to deliver full year results in line with management?s expectations," said Nick Jefferies, group chief executive
Thu, 02 Feb 2012 10:50:00 GMT

1,700 SiC Schottky diodes in TO-247 from Cree
Cree has introduced a series of packaged 1,700V Schottky diodes, which it claims is industry's highest blocking voltage. As with other Schottky devices, the silicon carbide diodes eliminate...
Thu, 02 Feb 2012 09:03:00 GMT

CEVA-XC323 DSP core design kit supports multi-standards
The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance
Thu, 02 Feb 2012 00:45:00 GMT

Parking sensors to take pain out of finding a space
A "parking patch" could bring together wireless sensors and mobile apps to steer drivers towards elusive vacant spots, while also allowing traffic wardens to home in on parking offenders.
Thu, 02 Feb 2012 00:04:00 GMT

Space: Vega's fist mission is carrying scientific spacecraft
To avoid the prospect of losing a high-value commercial payload on a risky maiden flight, Vega's first mission - VV01 - will carry a basket of scientific spacecraft, including nine so-called "cubesats", the 1kg 10cmx10cm boxes that are increasingly popular with low-budget researches thankful for any lift to orbit.
Thu, 02 Feb 2012 00:02:00 GMT

ADI adds fast converters to Xilinx 28nm design platform
The AD9739A D/A converter and AD9467 A/D converter FMC boards include all of the HDL (hardware description language) code and device drivers needed for design prototyping
Wed, 01 Feb 2012 15:31:00 GMT

NanoKTN delivers thermoelectric opportunities report
The Nanotechnology Knowledge Transfer Network has published a paper on next-generation thermoelectric and thermionic devices - exploring emerging technologies and market opportunities. "Thermal energy harvesting and...
Wed, 01 Feb 2012 15:04:00 GMT

Toshiba works with Movidius for 3D smartphone camera
The firm's MA1178 video processor chip has been combined with Toshiba?s 8 Megapixel extended depth of field cameras in a 3D camera module for smartphones
Wed, 01 Feb 2012 12:35:00 GMT

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