3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors

3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices. Read the news release: www.ibm.com